Detailed Product Description
Material: FR-4, FR-1, CM-1, high frequency
Surface finish: HAL, gold plating, gold finger, immersion silver, immersion gold,
immersion tin, OSP
Profile: routing, punching, V-cut, chamfering
Mini hole: 0.2mm
Mini line width: 4mil (0.1mm)
Mini line space: 4mil (0.1mm)
Copper thickness: from 0.5oz. to 6oz.
Special process: blind/buried hole
Inner packing:
Vacuum package
Outer packing:
Carton
