Detailed Product Description
Specifications: Board layer: 2 Material: FR-4 Minimum board thickness: 0.6mm Minimum line width: 0.25mm Minimum line spacing: 0.258mm Minimum hole diameter: 0.5mm Surface finishing: OSP / Entek / HAL Board thickness: 1.6mm Packing: Vacuum packing Main export markets: Eastern Europe, Western Europe, North America and Asia
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