Intel BTX Cooler Solution (Shenzhen Sky Electronic Technology Co., Ltd.,China)

Detailed Product Description

Patent Crimp fin design,Cu Fin insert the Cu base,which can debase the heat resistance greatly and make the heat conduction more exhaustive.

Solution Type: Crimped Fin, Cu Fin (t=0.3mm)
Application Pico BTX Form Factor (Type II)
Fan Dim: 70 X 70 X 38mm
Heat Sink Dim: L89mm X W108mm X H51mm
Weight: 895g
Cooler Profile
Dim:  L140mm X W120mm X H72mm